> Systems & Process Solutions
for deposition, etching
for deposition / etching
reactor chambers for various deposition plasma processes:
Vapour Deposition (PECVD)
Vapour Deposition (PVD) /Sputtering
Ion Etching (RIE)
chambers and modules also available:
Layer Deposition (ALD)
fabrication, integration and test of assemblies and modules ready for
“plug and play” with any mainframe or E21
style cluster tool configuration. Full qualification
to customer specifications.
vast experience in various process
chamber and reactor cell design
we can prepare custom designs to
the most demanding processing conditions:
Specialist in large
system (<5E-10 mbar,
bakeable to 200 Deg C).
chamber designs in relation
to conductance and gas
loading to ensure the most cost effective pumping
and pressure control systems
design to deliver any
specific processing conditions i.e. <1ppm O2 or H20.
will recommend best
pumping solutions for your process taking into account your
requirements, gas loads and conductance in order to achieve
vacuum levels ranging from rough vacuum to UHV.
. Fully Qualified
assembly and integration of subsystems
. Instruments selection i.e. MFCs, MFM, valving and manifolds.
measurement and control
/ Down-stream vacuum pressure control
. RGA and other ambient control
compliant, S2, E49, F1, F2, etc
development,Engineering & Design for commercialisation
Eng team has
succesful record in turning proof of
concept technology into commercial products and production
manufacturing equipment. We have succesfully
managed a number of projects for various application ranging
analytical instruments to semi-conductor manufacturing equipment. If
you think you are at this stage, take the next step and contact us, we
can deliver pre-commercial product.
to discuss your concept !